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M29W640GH70ZA6E MICRON M29W640GH70ZA6E

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Sunbeam Electronics (Hong Kong) Limited

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M29W640GH70ZA6E MICRON M29W640GH70ZA6E

Brand Name : MICRON

Model Number : M29W640GH70ZA6E

Place of Origin : CHINA

MOQ : 100

Price : Pls contact sales for updated price

Payment Terms : paypal, T/T

Supply Ability : 2K

Delivery Time : 7-15 days

Packaging Details : 500

MPN : M29W640GH70ZA6E

MFR : MICRON

Chip Density (bit) : 64M

Supplier Package : TFBGA48

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Product Technical Specifications

EU RoHS

Compliant

ECCN (US)

EAR99

Part Status

Obsolete

Automotive

PPAP

Cell Type

NOR

Chip Density (bit)

64M

Architecture

Sectored

Boot Block

Block Organization

Symmetrical

Address Bus Width (bit)

23/22

Sector Size

64Kbyte x 128

Page Size

4Words

Number of Bits/Word (bit)

8/16

Number of Words

8M/4M

Programmability

Yes

Timing Type

Asynchronous

Max. Access Time (ns)

Maximum Erase Time (S)

400/Chip

Maximum Page Access Time (ns)

Maximum Programming Time (ms)

400000/Chip

OE Access Time (ns)

Process Technology

CMOS

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3|3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

Program Current (mA)

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

Supplier Temperature Grade

Industrial

Command Compatible

ECC Support

Support of Page Mode

Yes

Minimum Endurance (Cycles)

100000

Packaging

Tray

Supplier Package

TFBGA

Pin Count

Standard Package Name

BGA

Mounting

Surface Mount

Package Height

0.9(Max)

Package Length

Package Width

PCB changed

Lead Shape

Ball

China M29W640GH70ZA6E MICRON M29W640GH70ZA6E wholesale

M29W640GH70ZA6E MICRON M29W640GH70ZA6E Images

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